Tuesday, February 13, 2018
SMIC Avezzano Fab Adopts DBI Stacking Process
SMIC Avezzano Fab Adopts DBI Stacking Process
BusinessWire, PRNewswire: SMIC and Invensas, a subsidiary of Xperi, announce the establishment of Invensas� Direct Bond Interconnect (DBI) at SMIC�s Avezzano facility (former LFoundry).
�Invensas� DBI technology enables SMIC to manufacture the high performance image sensors required in mobile, automotive, and consumer electronics applications,� said Sunny Hui, SVP of marketing at SMIC. �With this technology in place, SMIC is prepared to further expand this capability into volume manufacturing around the globe, both at 200mm and 300mm.�
�SMIC�s talented manufacturing team has done an excellent job integrating our DBI process into their high-volume manufacturing environment,� said Craig Mitchell, president of Invensas. �We are thrilled to announce that SMIC is ready to engage commercial customers and support the demand for high volume production of BSI image sensors with DBI.�
