Monday, February 12, 2018
2017 Pixel Technology in Review
2017 Pixel Technology in Review
TechInsights image sensor Senior Technical Analyst Ray Fontaine posts "Image Sensor Technology: Noteworthy Developments in 2017." The short article includes a lot of information:
"A noteworthy twist on Bayer RGB is Samsung�s TetraCell and OmniVision�s 4-Cell strategy for high resolution front-facing cameras. This strategy enables in-pixel binning for greater sensitivity (with lower resolution) for low-lit scenes.
...as we end 2017 we are happy to announce we have found 0.9 �m generation pixels in mass production!
...we are tracking new types of associated autofocus (AF) systems, including: laser-assist, lossless phase detection autofocus (PDAF) in 1.0 �m telephoto camera chips, new types of masked PDAF, etc. Samsung is notable for its preference of a dual photodiode (Dual Pixel) AF system that is successful in its own right, and does not currently require laser-assist AF.
...we still primarily see TSV-based chip-to-chip interconnect, although Sony has been using direct bond interconnects (Cu-Cu hybrid bonding, or DBI) since early 2016. We recently saw OmniVision and foundry partner TSMC join the hybrid bonding club and claim the new world record, based on TechInsights� findings, of 1.8 �m diameter, 3.7 �m pitch DBI pads.
...we�ve tracked in 2017 is the continued emergence of cameras with improved near infrared (NIR) sensitivity... We�re also analyzing the structures from new process flows in use, such as the pyramid surface diffraction structures on the SmartSens SC5035. Sony has previously announced a similar approach, and we expect a comparable structure in use for OmniVision�s announced Nyxel platform."
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| Samsung 0.9 �m ISOCELL Pixel with Tetracell Color Filters |
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| STM SOI IR Sensor from Apple iPhone X |
